|
|
|
Property \ Material . |
AlP . |
AlAs . |
AlSb . |
Structure |
Zinc Blende |
Zinc Blende |
. . . . |
Space Group |
F bar4 3m |
F bar4 3m |
F bar4 3m |
Lattice Parameter a0 at 300K
quoted from Singh 1993
|
0.54635 nm |
0.5660 nm |
0.61355 nm |
Nearest Neighbour Distance at 300K |
. . . |
0.2454 nm |
0.265 nm |
Density at 300K | . . . |
3.717 g.cm-3 |
4.29 g.cm-3 |
Elastic Modulus c11 at 300 K |
. . . . |
12.0x1011 dynes.cm-2 |
. . . . |
Linear Expansion Coeff. at 300 K |
. . . . |
ca. 5x10-6 K-1 |
. . . . |
LO Phonon Energy |
. . . |
50.1 meV |
. . . |
TO Phonon Energy |
. . . |
44.9 meV |
. . . |
Thermal Conductivity at 300 K |
. . . |
. . . Wcm-1K-1 |
. . . |
Melting Point |
. . . |
2013 K |
. . . |
Dielectric Constant, Low/Lowish Frequency |
9.8 |
10.06 |
12.04 |
Nature of Energy Gap Eg |
Indirect |
Indirect |
Indirect |
Energy Gap Eg at 300 K |
2.45 eV |
2.153 eV |
1.615 eV |
Energy Gap Eg at ca. 0 K |
2.505 eV (at 4 K) |
2.229 eV (at 4 K) |
1.686 eV (at 27 K) |
Intrinsic Carrier Conc. at 300 K |
. . . |
. . . cm-3 |
. . . . |
Ionisation Energy of Silicon Donor |
. . . . |
70 meV |
. . . . . |
Electron Effective Mass / m0 |
. . . |
0.1
(Singh 1993)
|
0.12
(Singh 1993)
|
Electron Hall Mobility at 300 K for n = . . |
. . . . |
. . . cm2/V.s |
. . . . |
Electron Hall Mobility at 77 K for n = . . . |
. . . . |
. . . cm2/V.s |
. . . |
Ionisation Energy of Zinc Acceptor |
. . . . |
. . . meV |
. . . |
Light Hole Effective Mass mlh/m0 |
. . . |
. . . |
. . . |
Heavy Hole Effective Mass mhh/m0 |
. . . |
. . . |
. . . |
Hole Density of States Mass mdos/m0 |
. . . |
. . . |
0.98
(Singh 1993)
|
Hole Hall Mobility at 300 K for p = . . . cm-3 |
. . . . |
. . . cm2/V.s |
. . . |
Hole Hall Mobility at 77 K for p=. . . cm-3 |
. . . . |
. . . cm2/V.s | . . . . |
. Property \ Material |
. AlP |
. AlAs |
. AlSb |
|
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Property \ Material . |
GaP . |
GaAs . |
GaSb . |
Structure (All Cubic) |
Zinc Blende |
Zinc Blende | Zinc Blende |
Space Group |
F bar4 3m |
F bar4 3m | F bar4 3m |
Lattice Parameter a0 at 300K |
0.5451 nm |
0.5653 nm | 0.609 nm |
Nearest Neighbour Distance at 300K |
0.2360 nm |
0.2448 nm | 0.264 nm |
Density at 300K | 4.129 g.cm-3 |
5.318 g.cm-3 |
5.63 g.cm-3 |
Bond Energy |
. . . |
6.52 eV/atom
Harrison, 1980
|
. . . |
Elastic Modulus c11 at 300 K |
. . . . |
11.9x1011 dynes.cm-2 |
. . . . . |
Linear Expansion Coeff. at 300 K |
. . . K-1 |
ca. 5.7x10-6 K-1 |
. . . K-1 |
LO Phonon Energy |
. . . |
285.0 cm-1 |
. . . |
TO Phonon Energy |
. . . |
267.3 cm-1 |
. . . |
Thermal Conductivity at 300 K |
. . . |
0.5 Wcm-1K-1 |
. . . |
Melting Point |
. . . |
1513 K | . . . |
Dielectric Constant (f=0 to f=RF) |
11.1 |
12.5 | 15.7 |
Nature of Energy Gap Eg |
Indirect |
Direct |
Direct |
Energy Gap Eg at 300 K |
2.272 eV |
1.424 eV |
0.75 eV |
Energy Gap Eg at ca. 0 K |
2.350 eV (at 0 K) |
1.5191 eV (at 0 K) |
0.8113 eV (at 2 K) |
Intrinsic Carrier Conc. at 300 K |
. . . |
2.1x106 cm-3 |
. . . . |
Ionisation Energy of Silicon Donor |
. . . . |
5.8 meV |
. . . . . |
Electron Effective Mass / m0 |
. . . |
0.067
(Singh 1993)
|
0.042
(Singh 1993)
|
Electron Hall Mobility at 300 K
for n=1.3x1013 cm-3 |
. . . . |
9200 cm2/V.s |
. . . . |
Electron Hall Mobility at 77 K
for n=1.3x1013 cm-3 |
. . . . |
2x105 cm2/V.s |
. . . . |
Ionisation Energy of Zinc Acceptor |
. . . . |
30.6 meV |
. . . . . |
Light Hole Effective Mass mlh/m0 |
. . . |
0.082
(Singh 1993)
|
. . . |
Heavy Hole Effective Mass mhh/m0 |
. . . |
0.45
(Singh 1993)
|
. . . |
Hole Density of States Mass mdos/m0 |
0.60
(Singh 1993)
|
. . . |
0.40
(Singh 1993)
|
Hole Hall Mobility at 300 K for
p=1x1014 cm-3 |
. . . . |
ca. 400 cm2/V.s |
. . . . |
Hole Hall Mobility at 77 K for p=. . . cm-3 |
. . . |
ca. 7000 cm2/V.s |
. . . |
. Property \ Material |
. GaP |
. GaAs |
. GaSb |
|
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Property \ Material . |
InP . |
InAs . |
InSb . |
Structure | Zinc Blende |
Zinc Blende |
Zinc Blende |
Space Group |
F bar4 3m |
F bar4 3m |
F bar 3m |
Lattice Parameter a0 at 300K |
0.586 nm |
0.605 nm | 0.647 nm |
Nearest Neighbour Distance at 300K |
0.254 nm |
0.262 nm |
0.280 nm |
Density at 300K |
4.81 g.cm-3 |
5.69 g.cm-3 |
5.80 g.cm-3 |
Elastic Modulus c11 at 300 K |
. . . . |
. . . . |
. . . . |
Linear Expansion Coeff. at 300 K |
. . . . |
. . . K-1 |
. . . . |
LO Phonon Energy |
. . . |
. . . cm-1 |
. . . |
TO Phonon Energy |
. . . |
. . . cm-1 |
. . . |
Thermal Conductivity at 300 K |
. . . |
. . . W.cm-1K-1 |
. . . |
Melting Point |
. . . |
. . .. K |
. . . |
Dielectric Constant (f=0 to f=RF) |
12.4 |
14.6 |
17.7 |
Nature of Energy Gap Eg |
Direct |
Direct |
Direct |
Energy Gap Eg at 300 K |
1.344 eV |
0.36 eV |
0.17 eV |
Energy Gap Eg at ca. 0 K |
1.424 eV (at 1.6 K) |
0.418 eV (at 4.2 K) |
0.237 eV (at 2 K) |
Intrinsic Carrier Conc. at 300 K |
. . . |
. . . cm-3 |
. . . . |
Ionisation Energy of Silicon Donor |
. . . . |
. . . meV |
. . . . . |
Electron Effective Mass / m0 |
0.073
(Singh 1993)
|
0.027
(Singh 1993)
|
0.013
(Sze 1969)
|
Electron Hall Mobility at 300 K for n = . . |
. . . |
. . .cm2/V.s |
. . . . |
Electron Hall Mobility at 77 K for n = . . |
. . . . |
. . . cm2/V.s |
. . . . |
Ionisation Energy of Zinc Acceptor |
. . . . |
. . . meV |
. . . . . |
Light Hole Effective Mass mlh/m0 |
. . . |
. . . |
. . . |
Heavy Hole Effective Mass mhh/m0 |
. . . |
. . . |
. . . |
Hole Density of States Mass mdos/m0 |
0.64
(Singh 1993)
|
0.4
(Singh 1993)
|
0.4
(Singh 1993)
|
Hole Hall Mobility at 300 K for p = . . . cm-3 |
. . . |
. . . cm2/V.s |
. . . . |
Hole Hall Mobility at 77 K for p = . . . cm-3 |
. . . . |
. . . cm2/V.s |
. . . . |
. Property \ Material |
. InP |
. InAs |
. InSb |
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